Basic Info.
Model NO.
Customized
Machining
CNC Machining
Material
Cu/Mo/Cu
Surface Preparation
Customize
Pressure Chamber Structure
Customize
Tolerance Grade
Customize
Casting Surface Quality Level
Customize
Certification
ISO 9001:2015
CMC13/74/13 Density
9.88 g/cm3
Transport Package
Vacuum Packing
Specification
Customized
Trademark
FOTMA
Origin
China
HS Code
854290000
Production Capacity
10000 Pieces/Month
Product Description
Cu/Mo/Cu(CMC) Heat Sink
Description:Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.
S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent property both low CTE and high thermal conductivity. Its higher thermal conductivity compared to other same kind of materials contributes to highly powered electronic packages.

Product Properties:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20ºC) | Thermal conductivity W/(M·K) |
CMC111 | 9.32 | 8.8 | 305(XY)/250(Z) |
CMC121 | 9.54 | 7.8 | 260(XY)/210(Z) |
CMC131 | 9.66 | 6.8 | 244(XY)/190(Z) |
CMC141 | 9.75 | 6 | 220(XY)/180(Z) |
CMC13/74/13 | 9.88 | 5.6 | 200(XY)/170(Z) |

Material | Wt% Molybdenum Content | g/cm3 Density | Thermal conductivity at 25ºC | Coefficient of thermal expansion at 25ºC |
S-CMC | 5 | 9.0 | 362 | 14.8 |
10 | 9.0 | 335 | 11.8 | |
13.3 | 9.1 | 320 | 10.9 | |
20 | 9.2 | 291 | 7.4 |

Application:
Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
S-CMC heat sink can be used in wireless communication packaging, opto electronics packaging etc.
Product show:




