Basic Info.
Model NO.
                                     Customized
                                 Machining
                                     CNC Machining
                                 Material
                                     Cu/Mo/Cu
                                 Surface Preparation
                                     Customize
                                 Pressure Chamber Structure
                                     Customize
                                 Tolerance Grade
                                     Customize
                                 Casting Surface Quality Level
                                     Customize
                                 Certification
                                     ISO 9001:2015
                                 CMC13/74/13 Density
                                     9.88 g/cm3
                                 Transport Package
                                     Vacuum Packing
                                 Specification
                                     Customized
                                 Trademark
                                     FOTMA
                                 Origin
                                     China
                                 HS Code
                                     854290000
                                 Production Capacity
                                     10000 Pieces/Month
                                 Product Description
    Cu/Mo/Cu(CMC) Heat Sink   
Description:Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.
S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent property both low CTE and high thermal conductivity. Its higher thermal conductivity compared to other same kind of materials contributes to highly powered electronic packages.

Product Properties:
| Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20ºC) | Thermal conductivity W/(M·K) | 
| CMC111 | 9.32 | 8.8 | 305(XY)/250(Z) | 
| CMC121 | 9.54 | 7.8 | 260(XY)/210(Z) | 
| CMC131 | 9.66 | 6.8 | 244(XY)/190(Z) | 
| CMC141 | 9.75 | 6 | 220(XY)/180(Z) | 
| CMC13/74/13 | 9.88 | 5.6 | 200(XY)/170(Z) | 
 
   | Material | Wt% Molybdenum Content | g/cm3 Density | Thermal conductivity at 25ºC | Coefficient of thermal expansion at 25ºC | 
| S-CMC | 5 | 9.0 | 362 | 14.8 | 
| 10 | 9.0 | 335 | 11.8 | |
| 13.3 | 9.1 | 320 | 10.9 | |
| 20 | 9.2 | 291 | 7.4 | 

Application:
Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
S-CMC heat sink can be used in wireless communication packaging, opto electronics packaging etc.
Product show:




 
   